EMBEDDED SYSTEMS SOLUTION & SERVICE

 

Why Us ?

It gives us immense excitement to understand that you have navigated to our page where we will introduce one of the most strong area of our expertise! We have working closely on latest and informative projects in several areas now which caters to the embedded systems development or embedded product engineering service. 

As a startup that has completed a mere term of 3 years, you will be awestruck to have a look at the successful projects and type of vast categorical projects we have handled. We have designed and provided consultancy in development of projects like Conventional Power Management & Analyses, IOT based data acquisition for Power and Oil & Gas Industries, Battery management platform designs, Home Automation & Smart Home solutions, Smart City implementation projects, Non-Conventional energy harvesting, smart agriculture & predictive analyses, smart fishery and numerous such aligned areas.

One of our strong area to work is IOT domain solutions: Communication related projects like Bluetooth (BT conv. / BLE 5.x), 2.4Ghz, 5Ghz & Sub-1Ghz domain radios like Zigbee, Threads, LoRAWAN, MIOTY, WiSun FAN, IEEE 802.15.4, Wireless M-Bus (T, S, C, N mode), 6LoWPAN, Wi-SUN NWP, Proprietary 2.4 GHz, Amazon Sidewalk, WiFi, etc using  several ARM Cortex M based SoCs from leading manufacturers.

We also work on low power device / product consultancy. You can contact us if you are looking forward in designing challenging products that needs constant data transmission and connectivity to a cloud service and powered by Li-Ion / similar batteries. Our designs for BLE /+ mesh, LoRA and such sleepy network architecture can help you build mesh/star connected units deployable across a wide area and powered by batteries with a battery recycling window of 5-10 years. we also provide complementary / dedicated cloud platform to help you integrate seamless UI for your client's ease to connect & control without compromising on security, data integrity & latest encryption.

Our experts have competencies in the field of Embedded Systems Design with experience of at least 12 years and direct working knowledge from renowned international silicon manufacturers . Our team members have working experience in Automotive, Linux driver development, Full Stack development, Industrial Automation and IOT. We also have expertise in AI/ML technologies where we can help you design products to resolve problems where manual intervention is difficult. One such use case is robotic car with IR cam based image analyses to replace boroscopy in annual maintenance of pipelines of several Power plants & other Plants. OCR based solutions are there for developing automatic decoding of image based actuation scenarios. Call us at +91 9748746164 for a detailed discussion.

We follow highly qualitative procedures in all the projects we undertake. Each code is developed under standard methodologies. We strictly follow Agile to track the development of the software and in general follow the standard SDLC. We have strong testing phases in the code we work on. As a part of QC/QA we take all the related measures to provide beast quality service and delivery along with highly standardized code sharing platform. We use gitHub to share and collaborate with the customer and the peer developers. We have very competitive pricing and that too with such standardized development. Give us a change and let us celebrate your success !

Have a feel of our endeavors ...


CISM DEVICE :

CLOUD INTEGRATED SOIL MONITERING UNIT WITH ACTUATOR CONTROL & CONNECTED ANDROID APP
Client: Smart Agriculture Industry, Home Automation, Smart City, Smart Factory Automation

This solution is ideal for those who are implementing smart agriculture projects with multiple soil monitoring sensors and reporting to cloud service with secured TLS/SSL web communication. You can also control multiple actuators with your own required business logic directly from cloud or through the device process. Built on TI's CC32xx Simplelink(TM) and RTOS, you will be assured minimum operational latency and service.

cloud based soil quality
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CISM

Smart Agriculture product engg. with soil quality monitoring and control over IOT platforms and cloud integration

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IOT INDUSTRIAL DATA LOGGER :

IOT INDUSTRIAL DATA LOGGER WITH MULTIPROTOCOL LINK LAYERS
Client: Thermal power generation plants, Govt. of India

Branon based IOT integration of industrial data acquisition over standard radios using mesh / star topologies. This is designed on our trusted and proven platform Branon framework using Texas Instruments' MSP430 series processing. It can cater to data collection over distributed channels for measuring parameters (like T, Pr, Hum., Level, PMx, SOx, Nox, etc) using 2.4G / Sub-1G networks and then transmitted to your cloud server. Cloud can ingest data for further AI/ML models to perform predictive analyses or other uses. Ideal for power, chemical, O&G, metering and likewise industries. Connectivity to internet may be through direct WiFi/ Ethernet or border routers over a LoRA / Threads / Bluetooth / Wi-SUN/ others

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Fully featured cloud

We can integrate all your business logics into AI/ML models implementable on cloud

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LOWest POWER DESIGN :

PRODUCT DESIGN ENGG. SERVICES FOR BMS / LOW POWER / ULTRA LOW POWER
Client: Several MSME working on remote unattended systems, Railways, Solar Power units, Non-Conventional energy, Energy Harvesting 

We have worked on several battery powered and non-conventional powered application design. Devices that are wither powered at remote locations with sleepy slave devices or working totally off the battery. We have worked on multiple optimization methods to make your battery powered application to make the most out of the battery energy and efficiency. These are ideal for remote location operation devices in multiple cross-domain technologies like edge connectivity units, sleepy end devices (for IOT Thread / WiSun / similar netowrks), single cell battery powered data transceivers, LoRAWAN connected units, medical devices, railways battery operated units. Adopting to proven platforms and ULP silicons from TI / ST Micro / NXP we can design your PoC as per your exact power requirement

PCB DESIGN SERVICES (2/4 LAYERS, SCHEMATIC, ASSEMBLY & FAB):

Client: Several MSMEs, Educational institutions,  Manufacturing Industries

We can design double or multilayer printed circuit boards for your product or POC at very nominal rates. Our designs are done by highly skilled and experienced personnel from the fabrication industry. We offer design of power, digital, comms, RF and multi-purpose special use case based PCB designing. We can also design the schematic for you from an existing system, reverse-engineer specific units, perform the schematic - layout and Gerber generation for your production phase, or even perform the complete LSTK PCB from the schematic design to PCB assembly. Our PCB manufacturing, design and assembly charges are very low and the product quality is highly reliable.

Have a look at our capabilities (all values are in mm):

 

Max. Board Size (L x W) 430 x 585 (For 1S & 2S)
415 x 565 (For 4L)
Max. Board Thickness 3.20
Min. Finished Board Thickness 0.20 (No HAL / Masking)
Base Material FR4
Inner Layer Copper Cladding  
Max. Cu Wt. For Planes (Oz.) 2
Max. Cu Wt. For Signals (Oz.) 2
Min. Cu Wt. (Oz.) 0.5
  Outer Layer Copper Clading
Max Cu Wt. (Oz.) 3
Min Cu Wt. (Oz.) 0.5
Circuit Layers
Specification Value
For Start Copper Thickness of 0.5 Oz.  
For Outer Layer Min Track Width 0.09
For Outer Layer Min Spacing 0.09
For Inner Layer Min Track Width 0.125
For Inner Layer Min. Spacing 0.125
For Start Copper Thickness of 1.0 Oz.  
Min Track Width 0.15
Min. Spacing 0.15
For Start Copper Thickness of 2.0 Oz.  
Min Track Width 0.175
Min. Spacing 0.20

Drill Layers

Specification Value
Min. Finished via Hole Size 0.10
Min. Finished via Pad Size  
Outer Layers 0.40
Inner Layers 0.45
Min. Annular Ring 0.10
Drill to Drill Clearance 0.15
Min. Slot Size For PTH Slots (Tool size) 0.50
Blind & Buried vias Manufacturable Yes
Drill to Track Clearance For Inner Layers (upto 6 layer) 0.25
Drill to Track Clearance for Inner Layers (>6 layer) 0.35
Min. Drill Size For Plated Holes on Board Edge 0.80
Min. Drill to Drill Clearance For Plated Holes on Board Edge 0.80

For more specification details please contact us. We offer minimum fab time of 7 days and minimum order quantity is 1. We offer lowest price of PCB fab ! Check us out

If you have any queries, please don't hesistate to call us at 9748746164 or email us at info@twinstruments.in